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Evaluation of BGA/CSP solder

Measuring the area ratio of internal voids in solder! By combining mechanical polishing, a comprehensive evaluation is possible.

In the evaluation of BGA and CSP solder, the area ratio of voids within the solder can be measured from transmitted X-ray image data. Furthermore, by combining mechanical polishing, a comprehensive evaluation is possible. Please feel free to consult us when needed. 【Features】 ■ Non-destructive evaluation of BGA (Ball Grid Array) solder - The area ratio (%) of voids within the solder can be measured non-destructively from images obtained through X-ray transmission observation. ■ Cross-sectional observation of CSP (Chip Size Package) and BGA (Ball Grid Array) - Cross-sectional observation through mechanical polishing allows for the observation of defects such as shrinkage cavities that are difficult to see with X-ray observation. *For more details, please refer to the PDF document or feel free to contact us.